Method of fabricating self-aligned silicide device using CMP

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437200, 437228, H01L 21265

Patent

active

056935501

ABSTRACT:
A titanium film and a polysilicon film are caused to react with each other to produce a TiSi.sub.2 layer of silicide. Thereafter, an upper end of a side wall is polished off to remove an electrically conductive TiSix layer which has been formed on the upper end of the side wall at the same time that the silicide has been formed. It is thus possible to keep low the layer resistance of the silicide layer on a gate electrode and a source-drain region and to prevent the source-drain region and the gate electrode from being short-circuited.

REFERENCES:
patent: 5286678 (1994-02-01), Rastogi
patent: 5472894 (1995-12-01), Hsu et al.
patent: 5472897 (1995-12-01), Hsu et al.
patent: 5491099 (1996-02-01), Hsu
patent: 5508212 (1996-04-01), Wang et al.
patent: 5567651 (1996-10-01), Berti et al.
patent: 5576227 (1996-11-01), Hsu
patent: 5607884 (1997-03-01), Byun
"Study of the Rapid Thermal Nitridation and Silicidation of Ti using Elastic Recoil Detection. II. Ti on SiO.sub.2 " Krooshof et al J. Appl. Phys. 63 (10), May 15, 1988; 1988 Institute of Physics; pp. 5110-5114.
"Titanium Disilicide Self-Aligned Source/Drain+Gate Technology" Lau et al IEEE; 1982; pp. 714-717, month unknown.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of fabricating self-aligned silicide device using CMP does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating self-aligned silicide device using CMP, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating self-aligned silicide device using CMP will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-800795

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.