Method of fabricating resistive conductive patterns on aluminum

Details Method of fabricating resistive conductive patterns on aluminum Method of fabricating resistive conductive patterns on aluminum

1991-10-20

1993-06-22

Quach, T. N.

Fishing, trapping, and vermin destroying

437 60, 437192, 437918, 437209, H01L 21283, H01L 2158

Patent

active

052216390

ABSTRACT:
A method of fabricating a resistive conductive pattern on an aluminum nitride substrate includes forming a resistive chromium containing film on the aluminum nitride substrate and then forming a refractory metal layer on the resistive film. The resistive film and refractory metal layer are then patterned and one or more conductive layers may then be formed on the patterned refractory metal layer. Resistors may then be formed between conductive lines patterned from the layers. These resistors are formed from the resistive film.

REFERENCES:
patent: 4777583 (1988-10-01), Minami et al.
patent: 4951014 (1990-08-01), Wohlert et al.
patent: 4963701 (1990-10-01), Yasumoto et al.
patent: 5018004 (1991-05-01), Okinaga et al.
patent: 5028306 (1991-07-01), Davis et al.
patent: 5041700 (1991-08-01), Iyogi et al.

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