Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1984-12-18
1987-03-24
Ozaki, George T.
Metal working
Method of mechanical manufacture
Assembling or joining
29576C, 29576E, 148 15, 148175, 148187, H01L 21477
Patent
active
046514104
ABSTRACT:
A method of fabricating bipolar integratable transistors includes a recrystallization step. A monocrystalline epitaxial layer is deposited upon a highly doped substrate and impurities are introduced into a portion of the epitaxial layer to form a first transistor region. A polysilicon layer is deposited upon the surface and a portion of the polycrystalline layer is recrystallized wherein the first transistor region serves as a seed. Impurities are introduced into the recrystallized portion to form a base. An additional polysilicon layer is deposited over the substrate and a portion is recrystallized wherein the base serves as a seed. A second transistor region is formed in the recrystallized portion of the additional polysilicon layer.
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Ozaki George T.
Semiconductor Division Thomson-CSF Components Corporation
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