Method of fabricating printed circuit board having embedded...

Details Method of fabricating printed circuit board having embedded... Method of fabricating printed circuit board having embedded...

2007-11-13

2007-11-13

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S832000, C029S846000

Reexamination Certificate

active

11325557

ABSTRACT:
The present invention relates to a method of fabricating a printed circuit board having embedded multi-layer passive devices, and particularly, to a method of fabricating a printed circuit board having an embedded multi-layer capacitor, in which a capacitor is formed to have multiple layers in the PCB to increase capacitance.

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