Method of fabricating polycrystalline silicon thin-film transist

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Field effect device in non-single crystal – or...

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257363, 257538, H01L 2976

Patent

active

057838437

ABSTRACT:
A method of fabricating a polycrystalline silicon thin-film transistor having two symmetrical lateral resistors is disclosed. Two sub-gates are formed along with a gate in the gate metal or polysilicon layer of the thin-film transistor. The two sub-gates that are located symmetrically on the two sides of the gate have equal distances to the gate. One sub-gate is near the drain of the thin film transistor and the other near the source. Two sections in the polycrystalline silicon layer of the thin film transistor are blocked by the two sub-gates and no impurity material is doped. The two undoped sections form the symmetrical lateral resistors of this invention. The lateral resistor near the drain decreases the electric field in the nearby depletion area when the thin-film transistor is switched off. The current leakage is reduced.

REFERENCES:
patent: 5250835 (1993-10-01), Izawa

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