Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2010-10-28
2011-10-11
Le, Dung A. (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S618000, C438S620000, C438S623000
Reexamination Certificate
active
08034664
ABSTRACT:
Provided is a three-dimensional aluminum package module including: an aluminum substrate; an aluminum oxide layer formed on the aluminum substrate and having at least one first opening of which sidewalls are perpendicular to an upper surface of the aluminum substrate; a semiconductor device mounted in the first opening using an adhesive; an organic layer covering the aluminum oxide layer and the semiconductor device; and a first interconnection line and a passive device circuit formed on the organic layer and the aluminum oxide layer.
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Background of the invention for the above captioned application (previously cited).
International Search Report prepared by the Korean Intellectual Property Office on Sep. 13, 2006 for PCT/KR2006/000751; Applicant, Wavenics Inc.
Kim Kyoung Min
Kwon Young-Se
Le Dung A.
Sheridan & Ross P.C.
Wavenics Inc.
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