Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Patent
1999-05-21
2000-09-19
Powell, William
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
216 38, 216 79, 216 88, 216 23, 438720, 438723, 438734, H01L 2100
Patent
active
061211516
ABSTRACT:
A method for fabricating a passivation layer. An isolation layer is formed on a metal layer over the substrate. The isolation layer on the metal layer is removed by chemical-mechanical polishing and dry etching. The planarization of the metal layer thus is obtained. A passivation layer having a certain structure and a thickness combination of different layers is formed over the substrate. The reflection rate of the metal layer is significantly enhanced.
REFERENCES:
patent: 6008112 (1999-12-01), Acocella et al.
patent: 6017821 (2000-01-01), Yang et al.
Huang Jiawei
Powell William
United Microelectronics Corp
United Semiconductor Corp
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