Method of fabricating package for housing semiconductor element

Details Method of fabricating package for housing semiconductor element Method of fabricating package for housing semiconductor element

1997-02-14

1999-07-06

Ryan, Patrick

Metal fusion bonding

Process

Preplacing solid filler

228254, 427 96, 427123, 148 24, 148 23, 148 22, H01L 2300

Patent

active

059187964

ABSTRACT:
A method of fabricating a package for housing a semiconductor element, comprising applying solder paste within plural depressions which are formed on at least one principal surface of an insulating substrate and have electrical connection pads, protruding the surface of the solder paste from the principal surface of the insulating substrate, mounting solder balls on the surface of the solder paste, and fusing the solder paste and the solder balls to produce unitary structures in order to form connection terminals with spherical protrusions.

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patent: 4830264 (1989-05-01), Bitaillow et al.
patent: 4906823 (1990-03-01), Kushima et al.
patent: 5133495 (1992-07-01), Angulas et al.
patent: 5203075 (1993-04-01), Angulas et al.
patent: 5442852 (1995-08-01), Danner
patent: 5620129 (1997-04-01), Rogren

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