Semiconductor device manufacturing: process – Having organic semiconductive component
Reexamination Certificate
2006-02-14
2011-12-27
Blum, David S (Department: 2813)
Semiconductor device manufacturing: process
Having organic semiconductive component
C438S623000, C257SE23167, C257SE21576
Reexamination Certificate
active
08084294
ABSTRACT:
An organic silicon film is formed by carrying out chemical vapor deposition with organic silicon compound being used as a raw material gas. The organic silicon compound contains at least silicon, hydrogen and carbon as a constituent thereof, and contains two or more groups having unsaturated bond, per a molecule thereof. The organic silicon compound is used in mixture with a silicon hydride gas.
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Japanese Official Action—2007-503657—Jun. 21, 2011.
Japanese Official Action—2007-503657—Sep. 13, 2011.
Hayashi Yoshihiro
Tada Munehiro
Takeuchi Tsuneo
Blum David S
NEC Corporation
Snow Colleen E
Young & Thompson
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