Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Making emissive array
Patent
1995-08-21
1997-06-24
Angebranndt, Martin
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Making emissive array
430 23, 430 29, 430315, 430324, 430321, 437 80, 437 89, 437905, 437944, 257 40, 257 89, 257 79, 427468, 427487, 427 66, 427 68, 427 69, 427155, 427162, 427251, 427261, 427615, 427282, 438 99, 438 38, B05D 132, G03C 556
Patent
active
056416113
ABSTRACT:
Items of material are patterned on a substrate by forming a layer of photoresist on the substrate and a layer of metal on the photoresist. The photoresist is patterned to define an opening exposing a portion of the substrate and the metal is patterned to define an aperture smaller than the opening so as to divide the exposed surface of the substrate into shadow areas and a non-shadow area. A first material system is evaporated generally perpendicular to the aperture to form a first organic light emitting diode on the surface of the substrate in the non-shadow area and second and third material systems are evaporated at angles to the aperture to form second and third organic light emitting diodes in the shadow areas. Passivation material is evaporated perpendicularly onto the first diode and at the angle onto the second diode.
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Elliot, David. "Integrated Circuit Fabrication Technology", .COPYRGT.1982 pp. 26-33.
IBM Tech. Discl. Bull. vol. 27, No. 5, (Oct. 1984) pp. 3026-3027.
Lee Hsing-Chung
Shieh Chan-Long
Angebranndt Martin
Motorola
Parsons Eugene A.
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