Semiconductor device manufacturing: process – Having organic semiconductive component
Reexamination Certificate
2006-10-30
2009-12-22
Ghyka, Alexander G (Department: 2812)
Semiconductor device manufacturing: process
Having organic semiconductive component
C438S028000, C438S029000, C438S042000, C257SE21411
Reexamination Certificate
active
07635608
ABSTRACT:
A fabricating method of organic electronic device is provided. The method comprises: providing a flexible substrate; fabricating a plurality of organic elements on the flexible substrate; fabricating a patterned spacing layer on the flexible substrate; and arranging a cover substrate on the patterned spacing layer, and sealing the edges of the flexible substrate and the cover substrate with a sealant, wherein the patterned spacing layer is used to maintain a space between the flexible substrate and the cover substrate.
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Ho Jia-Chong
Hu Tarng-Shiang
Lee Cheng-Chung
Lin Tsung-Hsien
Ghyka Alexander G
Industrial Technology Research Institute
Jianq Chyun IP Office
Nikmanesh Seahvosh J
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