Method of fabricating optical component including first and seco

Details Method of fabricating optical component including first and seco Method of fabricating optical component including first and seco

1994-09-30

1996-03-12

Lee, John D.

Optical waveguides

With optical coupler

Input/output coupler

385 47, 385 48, 385 65, G02B 626

Patent

active

054993091

ABSTRACT:
A V groove and guide grooves are defined in a ceramic substrate, and an optical fiber is fixedly disposed in the V groove by the ceramic substrate and a cover, thereby producing a first optical waveguide chip. A V groove and guide grooves are also defined in another ceramic substrate, and an optical fiber is fixedly disposed in the V groove by the ceramic substrate and a cover, thereby producing a second optical waveguide chip. The first optical waveguide chip has an end face inclined to the direction of propagation of light through the optical fiber thereof, and the second optical waveguide chip also has an end face inclined to the direction of propagation of light through the optical fiber thereof. The first and second optical waveguide chips are positioned relatively to each other by guide pins intimately placed in the guide grooves, and the inclined end faces extend substantially parallel to each other with an air layer interposed therebetween. An optical component such as an optical transmission/reception module thus produced can easily be reduced in size and cost, and fabricated in an integrated configuration.

REFERENCES:
patent: 3970360 (1976-07-01), Kersten et al.
patent: 4165496 (1979-08-01), Domenico, Jr. et al.
patent: 4285571 (1981-08-01), Winzer
patent: 4373775 (1983-02-01), Gasparian
patent: 4900118 (1990-02-01), Yanagawa et al.
patent: 5390266 (1995-02-01), Heitmann et al.
"Optical Fiber Coupling Approaches for Multi-Channel Laser and Detector Arrays," K. P. Jackson et al., SPIE, vol. 994, Optoelectronic Materials, Devices, Packaging, and Interconnects II (1988), pp. 40-47 (no month).

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