Method of fabricating nitride semiconductor, method of...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Compound semiconductor

Reexamination Certificate

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C438S044000, C438S047000, C438S604000, C257S103000

Reexamination Certificate

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06911351

ABSTRACT:
The method of fabricating a nitride semiconductor of this invention includes the steps of forming, on a substrate, a first nitride semiconductor layer of AluGavInwN, wherein 0≦u, v, w≦1 and u+v+w=1; forming, in an upper portion of the first nitride semiconductor layer, plural convexes extending at intervals along a substrate surface direction; forming a mask film for covering bottoms of recesses formed between the convexes adjacent to each other; and growing, on the first nitride semiconductor layer, a second nitride semiconductor layer of AlxGayInzN, wherein 0≦x, y, z≦1 and x+y+z=1, by using, as a seed crystal, C planes corresponding to top faces of the convexes exposed from the mask film.

REFERENCES:
patent: 4840922 (1989-06-01), Kobayashi et al.
patent: 4855256 (1989-08-01), Kobayashi et al.
patent: 5549747 (1996-08-01), Bozler et al.
patent: 5625637 (1997-04-01), Mori et al.
patent: 5739554 (1998-04-01), Edmond et al.
patent: 5972730 (1999-10-01), Saito et al.
patent: 6046465 (2000-04-01), Wang et al.
patent: 6153010 (2000-11-01), Kiyoku et al.
patent: 6252894 (2001-06-01), Sasanuma et al.
patent: 6335546 (2002-01-01), Tsuda et al.
patent: 6448102 (2002-09-01), Kneissl et al.
patent: 6608327 (2003-08-01), Davis et al.
patent: 6764932 (2004-07-01), Kong et al.
patent: 2001/0010372 (2001-08-01), Takeuchi et al.
patent: 2001/0026658 (2001-10-01), Althaus et al.
patent: 60161489 (1984-01-01), None
patent: 62282474 (1986-05-01), None
patent: 02214182 (1989-02-01), None
patent: 11068256 (1997-08-01), None
patent: 11251631 (1999-09-01), None
patent: 11312825 (1999-11-01), None
patent: 2002-518826 (1999-12-01), None
patent: 2000-106455 (2000-04-01), None
Tsvetanka et al., “Pendeo-Epitaxy: A new Approach for Lateral growth of Gallium Nitride Films”, Journal of Electronic Materials, vol. 28, No. 4., L5-L8, Apr. 1999.
I. Kim et al., “Crystal tilting in GaN grown by pendeopitaxy method on sapphire substrate”, Applied Physics Letters, vol. 75, No. 26, pp. 4109-4111, Dec. 27, 1999.
A. Sakai, “Transmission electron microscopy of defects in GaN films formed by epitaxial lateral overgrowth”, Applied Physics Letters, vol. 73, No. 4, pp. 481-483, Jul. 27, 1998.
H. Sone et al., “Optical and Crystalline Properties of Epitaxial-Lateral-Overgrown-GaN Using Tungsten Mask by Hydride Vapor Phase Epitaxy”, Jpn. J. Appl. Phys. vol. 38 (1999), Part 2, No. 4A, pp. L356-L359, Apr. 1, 1999.
Tsvetanka et al., “Pendeo-Epitaxy: A new Approach for Lateral growth of Gallium Nitride Films”, Journal of Electronic Materials, vol. 28, No. 4., L5-L8, Apr. 1999.

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