Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1986-09-29
1988-04-12
Dawson, Robert A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156289, 156323, 1565833, 428157, 428172, 428189, B32B 3120, B32B 3300
Patent
active
047372087
ABSTRACT:
Disclosed is a method for laminating multilayer structures with nonplanar surfaces such as structures which include cavity (20) formed therein. A conformal material (32), a release material (31), and an optional template (36) are provided over the structure prior to the lamination bonding operation. The conformal and release materials then fill the cavity during the bonding operation to prevent flow of adhesive (25 and 26) from between the layers into the cavity, and the template redistributes cavity edge stresses to minimize wire bonding pad deflections. The materials can then be removed for further processing of the multilayer structure.
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patent: 4636275 (1987-01-01), Norell
patent: 4643935 (1987-02-01), McNeal et al.
patent: 4680075 (1987-07-01), McNeal et al.
"Tedlar" PVF Film Technical Bulletin, DuPont Co., No. TD-34 (Jan. 1982).
"Fabrication of FR-4 Pin-Grid Arrays", Proceedings of the National Electronic Packaging and Production Conference, Feb. 25-27, 1986, pp. 889-897, Nagy.
Bloechle Donald P.
Kalliat Mohanan P.
Mazeika William A.
American Telephone and Telegraph Company AT&T Bell Laboratories
AT&T - Technologies, Inc.
Birnbaum Lester H.
Dawson Robert A.
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