Method of fabricating multilayer printed-circuit board

Details Method of fabricating multilayer printed-circuit board Method of fabricating multilayer printed-circuit board

1984-12-21

1986-09-30

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29830, 1563074, 174 685, 428213, 428901, B32B 3100, C09J 502

Patent

active

046145591

ABSTRACT:
A method of fabricating a multilayer printed-circuit composite in which a plurality of internal layer sheets are stacked in an alternate arrangement with one another and laminated together. The relatively thin and thick internal layer sheets are stacked alternately with adhesive material sheets being interposed between the adjacent internal layer sheets. By melting the adhesive material sheets, the stacked internal layer sheets are laminated together. This structure of the multilayer printed-circuit board is effective for reducing the dimensional changes of the internal layer sheet when compared with the structure composed only of thin internal layer sheets. Thus, the multilayer printed-circuit composite can be realized in a relatively small overall thickness while reducing the dimensional changes of the individual internal layer sheets.

REFERENCES:
patent: 4180608 (1979-12-01), Del

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