Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-02-08
2005-02-08
Smith, Matthew (Department: 2825)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S800000, C156S089110
Reexamination Certificate
active
06852569
ABSTRACT:
A method of fabricating a multilayer ceramic substrate includes stacking one or a plurality of unfired ceramic greensheets on one or both sides of a previously fired ceramic substrate, thereby forming a stack, each unfired ceramic greensheet having a firing temperature substantially equal to or lower than a firing temperature of the previously fired ceramic substrate, stacking a restricting greensheet on the unfired ceramic greensheet composing an outermost layer of the stack, the restricting greensheet having a higher firing temperature than each unfired ceramic greensheet, firing the stack at the firing temperature of the unfired ceramic green sheets with or without pressure applied via the restricting greensheet while the stack is under restriction by the restricting greensheet, thereby integrating the stack, and eliminating remainders of the restricting greensheet after the firing step.
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Fukuta Junzo
Mizuno Yoshio
Naka Katsuhiko
Nakano Satoshi
Foley & Lardner LLP
Malsawma Lex H.
Murata Manufacturing Co. Ltd.
Smith Matthew
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