Method of fabricating microwave interconnects and packaging and

Details Method of fabricating microwave interconnects and packaging and Method of fabricating microwave interconnects and packaging and

1992-06-11

1996-11-12

Pascal, Robert J.

Wave transmission lines and networks

Long lines

Strip type

333243, H01P 308

Patent

active

055744150

ABSTRACT:
A multilayer microwave structure for digital, power, RF and other interconnects wherein the metal (3, 7) and insulator (9) structure is built up in additive sequential steps over a base (5). Hermeticity within the structure is provided by forming an oxide layer (65) within the insulator portion of the structure which contacts the metal at all perimeter portions thereof.

REFERENCES:
patent: 4673904 (1987-06-01), Landis
patent: 5008639 (1991-04-01), Pavio
patent: 5068632 (1991-11-01), Champean

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