Method of fabricating microwave FET having gate with submicron l

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437176, 437229, 437245, 437912, 148DIG143, 430312, H01L 21265

Patent

active

049353772

ABSTRACT:
Disclosed is a method of forming a uniform length gate electrode and contact for a microwave field-effect transistor where the gate electrode has a length of less than one micron. A photoresist plug is formed on the surface of a first photoresist layer, the plug functioning as a shadow mask in the subsequent deposition of a plasma-etch-resistant material (aluminum) over the surface of the plug and the first photoresist layer. A third photoresist layer is formed over the device structure whereby a contact region can be formed on the surface of the semiconductor sub-strate adjacent to the device region. Subsequently, the third photoresist layer is removed, and the previously shielded photoresist material over the gate electrode location is removed by plasma etch using the metal-covered plug and metal-covered first photoresist layer as a plasma-etch shield. A metal is then deposited in the exposed surface region for the gate electrode and contact, and thereafter the photoresist material is removed leaving the gate electrode and contact on the substrate surface.

REFERENCES:
patent: 4618510 (1986-10-01), Tan

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of fabricating microwave FET having gate with submicron l does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating microwave FET having gate with submicron l, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating microwave FET having gate with submicron l will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2260254

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.