Method of fabricating microneedles

Details Method of fabricating microneedles Method of fabricating microneedles

2006-08-29

2006-08-29

Ahmed, Shamim (Department: 1765)

Etching a substrate: processes

Forming or treating an article whose final configuration has...

C216S002000, C216S041000, C216S074000, C427S430100, C205S080000

Reexamination Certificate

active

07097776

ABSTRACT:
A low cost method for fabricating microneedles is provided. According to one embodiment, the fabrication method includes the steps of: providing a substrate; forming a metal-containing seed layer on the top surface of the substrate; forming a nonconductive pattern on a portion of the seed layer; plating a first metal on the seed layer and over the edge of the nonconductive pattern to create a micromold with an opening that exposes a portion of the nonconductive pattern, the opening having a tapered sidewall surface; plating a second metal onto the micromold to form a microneedle in the opening; separating the micromold with the microneedle formed therein from the seed layer and the nonconductive pattern; and selectively etching the micromold so as to release the microneedle.

REFERENCES:
patent: 6334856 (2002-01-01), Allen
patent: 6749792 (2004-06-01), Olson
patent: 6875613 (2005-04-01), Shartle et al.
patent: 2002/0155737 (2002-10-01), Shuvo
patent: 2005/0011858 (2005-01-01), Kuo et al.

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