Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-08-31
2009-06-30
Chambliss, Alonzo (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S125000, C029S854000, C029S857000, C029S874000, C257S724000, C257S774000, C257S782000, C257SE23011, C257SE21577
Reexamination Certificate
active
07553699
ABSTRACT:
Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. An embodiment of one such method includes forming a plurality of through holes in a substrate with the through holes arranged in arrays, and attaching a plurality of singulated microelectronic dies to the substrate with an active side of the individual dies facing toward the substrate and with a plurality of terminals on the active side of the individual dies aligned with corresponding holes in the substrate. The singulated dies are attached to the substrate after forming the holes in the substrate.
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Search Report and Written Opinion issued Dec. 31, 2008 in Singapore Application No. 20060527-6.
Chambliss Alonzo
Micro)n Technology, Inc.
Perkins Coie LLP
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