Method of fabricating microelectromechanical systems devices

Details Method of fabricating microelectromechanical systems devices Method of fabricating microelectromechanical systems devices

2008-11-11

2011-12-06

Vinh, Lan (Department: 1713)

Etching a substrate: processes

Forming or treating thermal ink jet article

C216S033000, C216S066000

Reexamination Certificate

active

08070969

ABSTRACT:
A method of fabricating microelectromechanical systems devices is disclosed. A silicon substrate having a plurality of microelectromechanical systems elements formed on a first surface thereof is provided. A guard layer defining a plurality of recesses is applied to the silicon substrate such that respective microelectromechanical systems elements are located within respective recesses. The silicon substrate is then segmented into discrete parts and an adhesive layer is bonded to a second surface of the silicon substrate. The guard layer is next segmented into discrete parts corresponding to the discrete parts of the silicon substrate, thereby forming individual microelectromechanical systems devices. Finally, the adhesive layer is selectively exposed to a light source allowing removal of individual microelectromechanical systems devices.

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