Etching a substrate: processes – Etching to produce porous or perforated article
Reexamination Certificate
2008-02-27
2011-11-08
Culbert, Roberts (Department: 1716)
Etching a substrate: processes
Etching to produce porous or perforated article
C216S025000
Reexamination Certificate
active
08052884
ABSTRACT:
A method of fabricating a microchannel plate includes defining a plurality of pores extending from a top surface of a substrate to a bottom surface of the substrate where the plurality of pores has a resistive material on an outer surface that forms a first emissive layer. A second emissive layer is formed over the first emissive layer. The second emissive layer is chosen to achieve at least one of an increase in secondary electron emission efficiency and a decrease in gain degradation as a function of time. A top electrode is formed on the top surface of the substrate and a bottom electrode is formed on the bottom surface of the substrate.
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Beaulieu David
De Rouffignac Philippe
Potter Michael D.
Sullivan Neal T.
Tremsin Anton
Arradiance, Inc.
Culbert Roberts
Rauschenbach Kurt
Rauschenbach Patent Law Group, LLP
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