Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1990-04-09
1993-01-26
Picard, Leo P.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
361400, 257751, 257951, H01L 2302
Patent
active
051824205
ABSTRACT:
A method for simultaneously manufacturing metallized carriers from wafer-shaped substrates is described, wherein such wafer-shaped substrates permit the use of standard IC fabrication apparatus and methods. As a result, very thin and finely dimensioned traces can be deposited. Thin-film manufacturing techniques are used to create the high-density traces on the surface of the chip carriers, thereby permitting direct connections from the IC to the periphery of the carrier without the need for vias. A lid hermetically seals and protects the package. The traces are comprised of a plurality of metals to facilitate bonding, each of the metals homogeneous for a portion of the trace. One metal portion of the trace is of a type compatible with an IC chip placed in the carrier. Another metal portion of the trace is of a type compatible with a trace on a printed circuit board. A metal barrier is interposed between the metals to prevent metal diffusion from one metal to an adjoining portion of another metal.
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August Melvin C.
Christie Diane M.
Nelson Stephen
Neumann Eugene F.
Steitz Richard R.
Cray Research Inc.
Ledynh Bot
Picard Leo P.
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