Method of fabricating metal printed wiring boards

Metal working – Method of mechanical manufacture – Electrical device making

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53 30S, 174 685, 317101B, 427 27, 427 28, 427 96, 427 97, H05K 310

Patent

active

039343340

ABSTRACT:
An additive process for producing printed wiring boards is taught. In the process metal substrates having desired hole patterns are powder coated with a dielectric material electrostatically. The dielectric powder coating is then fused on the metal substrate. Next, a continuous film of pre-catalyzed adhesive is applied to all surfaces; then a plating resist is applied to all areas on which copper is not desired. The exposed catalyzed adhesive is then activated and plated in an electroless copper bath.

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