Method of fabricating mask-over-copper printed circuit boards

Details Method of fabricating mask-over-copper printed circuit boards Method of fabricating mask-over-copper printed circuit boards

1977-01-31

1978-05-09

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

427 97, C25D 502, C25D 554

Patent

active

040885453

ABSTRACT:
A method of fabricating mask-over-copper printed circuit boards from a laminated insulated board material having conductive metallic coatings on both sides thereof includes piercing a plurality of holes completely through the laminate, forming a desired circuit connection pattern of copper extending between selected holes on the laminate first side and electrically connecting the laminate first side connection pattern to the second side copper coating by depositing copper material through the holes. A solder mask is applied to the areas of the first side connection pattern which are to be protected from solder during subsequent fabrication steps and then a protective metallic material is electroplated to portions of the first side connection pattern not covered by the solder mask and to desired portions of a circuit connection pattern on the second side conductive metallic coating, and the portions of the laminate second side conductive metallic coating outside the second side connection pattern are then removed.

REFERENCES:
patent: 2872391 (1959-02-01), Hauser et al.
patent: 2912312 (1959-11-01), Japel
patent: 3060076 (1962-10-01), Robinson
patent: 3143484 (1964-08-01), Olin et al.
patent: 3208921 (1965-09-01), Hill
patent: 3475284 (1969-10-01), Olson
patent: 3702284 (1972-11-01), Merkenschlager

Affiliated with

Also associated with

Rating

Method of fabricating mask-over-copper printed circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating mask-over-copper printed circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating mask-over-copper printed circuit boards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2355870