Method of fabricating magnetic bubble circuits

Details Method of fabricating magnetic bubble circuits Method of fabricating magnetic bubble circuits

1975-06-02

1978-08-01

Weiffenbach, Cameron K.

Coating processes

Electrical product produced

Metal coating

427130, 427131, 427132, 427264, 427265, 427271, B05D 512

Patent

active

041044223

ABSTRACT:
In a bubble chip, increased spacing between a circuit overlay and a sheet of magnetic bubble material is provided at selected locations for particular circuit elements from which bubbles are to be deflected by magnetic repulsion. Differential spacing is achieved in one embodiment by means of a stratified spacing layer composed of the conventional nonmagnetic spacing layer plus a layer of nonmagnetic metal etched to form a mesa pattern which may include electrical control leads where necessary.

REFERENCES:
patent: 3677843 (1972-07-01), Reiss
patent: 3723716 (1973-03-01), Bobeck et al.
patent: 3919055 (1975-11-01), Urban
patent: 3932688 (1976-01-01), Sugita
patent: 3967002 (1976-06-01), Almasi et al.
patent: 4013803 (1977-03-01), Josephs

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