Method of fabricating light emitting diode package

Details Method of fabricating light emitting diode package Method of fabricating light emitting diode package

2008-05-13

2008-05-13

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S115000, C438S057000, C438S069000, C438S071000, C438S125000, C438S127000, C438S974000

Reexamination Certificate

active

07371603

ABSTRACT:
The invention relates to an LED package and proposes a method of fabricating an LED package including steps of providing a package substrate having a mounting area of an LED and a metal pattern to be connected with the LED, and plasma-treating the package substrate to reform at least a predetermined surface area of the package substrate where a resin-molded part will be formed. The method also includes mounting the LED on the mounting area on the substrate package and electrically connecting the LED with the metal pattern, and forming the resin-molded part in the mounting area of the LED to seal the LED package.

REFERENCES:
patent: 6610563 (2003-08-01), Waitl et al.
patent: 6953952 (2005-10-01), Asakawa
patent: 7045905 (2006-05-01), Nakashima
patent: 2002-151747 (2002-05-01), None

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