Method of fabricating leadframe based flash memory cards...

Details Method of fabricating leadframe based flash memory cards... Method of fabricating leadframe based flash memory cards...

2005-12-29

2009-02-10

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S068000, C438S462000, C438S508000, C438S508000

Reexamination Certificate

active

07488620

ABSTRACT:
Methods for forming leadframe-based semiconductor packages having curvilinear shapes are disclosed. The leadframes may each include one or more curvilinear slots corresponding to curvilinear edges in the finished and singulated semiconductor package. After encapsulation, the integrated circuit packages on the panel may be singulated by cutting the integrated circuits from the leadframe panel into a plurality of individual integrated circuit packages. The slots in the leadframe advantageously allow each leadframe to be singulated using a saw blade making only straight cuts.

REFERENCES:
patent: 5652185 (1997-07-01), Lee
patent: 6858470 (2005-02-01), Han et al.
patent: 2004/0259291 (2004-12-01), Takiar
patent: 2005/0133890 (2005-06-01), Liao et al.
patent: 2007/0099340 (2007-05-01), Takiar et al.
patent: 20020007877 (2002-01-01), None
patent: 0178140 (2001-10-01), None
International Search Report dated Jul. 27, 2007 in PCT Application No. PCT/US2006/049383.
International Preliminary Report and Written Opinion dated Jul. 10, 2008, in PCT Application No. PCT/US2006/049383.

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