Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-02-13
2007-02-13
Trinh, Minh (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S855000, C029S840000, C029S841000, C029S843000, C228S180210, C438S015000, C438S119000, C257S686000
Reexamination Certificate
active
10338974
ABSTRACT:
A known good die is economically fabricated. A tested integrated circuit is provided which includes a die having a bonding location on an upper surface and a lead. An upper portion of the integrated circuit package is removed or ground away to expose the bonding location. The lead is removed leaving the die and exposed bonding location to provide a known good die. The backside portion of the integrated circuit package is removed or ground away to expose the backside of the die. A contact pad is disposed on the bonding location. The bonding wire and exterior lead are also removed or ground away. The upper portion of the bonding ball is removed to provide a flattened bonding location. Preferably, the tested integrated circuit package provided is a thin small outline integrated circuit package (TSOP), and advantageously may be a packaged flash memory integrated circuit.
REFERENCES:
patent: 4028722 (1977-06-01), Helda
patent: 4889612 (1989-12-01), Geist et al.
patent: 4989063 (1991-01-01), Kolesar, Jr.
patent: 4994215 (1991-02-01), Wiech, Jr.
patent: 5008213 (1991-04-01), Kolesar, Jr.
patent: 5086018 (1992-02-01), Conru et al.
patent: 5111278 (1992-05-01), Eichelberger
patent: 5270673 (1993-12-01), Fries et al.
patent: 5280192 (1994-01-01), Kryzaniwsky
patent: 5291061 (1994-03-01), Ball
patent: 5454160 (1995-10-01), Nickel
patent: 5466634 (1995-11-01), Beilstein, Jr. et al.
patent: 5502621 (1996-03-01), Schumacher et al.
patent: 5502667 (1996-03-01), Bertin et al.
patent: 5530292 (1996-06-01), Waki et al.
patent: 5585600 (1996-12-01), Froebel et al.
patent: 5585668 (1996-12-01), Burns
patent: 5699234 (1997-12-01), Saia et al.
patent: 5700697 (1997-12-01), Dlugokecki
patent: 5701233 (1997-12-01), Carson et al.
patent: 5703400 (1997-12-01), Wojnarowski et al.
patent: 5739581 (1998-04-01), Chillara et al.
patent: 5778520 (1998-07-01), Kim et al.
patent: 5836071 (1998-11-01), Falcone et al.
patent: 6028352 (2000-02-01), Eide
patent: 6060373 (2000-05-01), Saitoh
patent: 6080262 (2000-06-01), Wang
patent: 6103553 (2000-08-01), Park
patent: 6140695 (2000-10-01), Tandy
patent: 6307256 (2001-10-01), Chiang et al.
patent: 6342398 (2002-01-01), Lin
patent: 6368886 (2002-04-01), Van Broekhoven et al.
patent: 6429028 (2002-08-01), Young et al.
patent: 6440835 (2002-08-01), Lin
patent: 6630369 (2003-10-01), Rubin
patent: 6706971 (2004-03-01), Albert et al.
patent: 6818980 (2004-11-01), Pedron, Jr.
patent: 2002/0100600 (2002-08-01), Albert et al.
patent: 2003/0094704 (2003-05-01), Gann
Irvine Sensors Corporation
Trinh Minh
LandOfFree
Method of fabricating known good dies from packaged... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of fabricating known good dies from packaged..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating known good dies from packaged... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3863101