Method of fabricating inverted modulation-doped heterostructure

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437105, 437108, 437133, 437248, 148DIG72, H01L 21265

Patent

active

053228081

ABSTRACT:
A donor layer (17) including an undoped wide bandgap material (14) and an n-type dopant (16) is deposited on a substrate (12) by molecular beam epitaxy (MBE) at a first temperature which is high enough for optimal growth of the donor layer (17). The dopant (16) is silicon or another material which exhibits surface segregation in the wide bandgap material (14) at the first temperature. An undoped spacer layer (18) of the wide bandgap material is deposited on the donor layer (17) at a second temperature which is sufficiently lower than the first temperature that surface segregation of the dopant material from the donor layer (17) into the spacer layer (18) is substantially suppressed. A channel layer (20) of a narrow bandgap material is formed on the spacer layer (18) at a third temperature which is higher than the second temperature and selected for optimal growth of the channel layer (20). The spacer layer (18) is substantially undoped, and the low temperature growth and reduction of donor movement reduces ionized impurity scattering in the channel layer (20).

REFERENCES:
patent: 4859625 (1989-08-01), Matsumoto
patent: 4908325 (1990-03-01), Berenz
patent: 4939102 (1990-07-01), Hamm et al.
patent: 5024967 (1991-06-01), Kopf et al.
"High Performance inverted HEMT and its application to LSI", S. Nishi et al., Inst. Phys. Conf. Ser. No. 83, 1987, pp. 515-520.
"Improved High Frequency Performance of AlInAs/GaInAs HBTs Through Use of Low Temperature GaInAs", W. Stanchina et al., InP and Related Compounds Conference Proceedings, Denver 1990, pp. 13-16.
"Si dopant migration and the AlGaAs/GaAsinverted interface", L. Pfeiffer et al., Appl. Phys. Lett. vol. 58, No. 20, May 20, 1991, pp. 2258-2260.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of fabricating inverted modulation-doped heterostructure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating inverted modulation-doped heterostructure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating inverted modulation-doped heterostructure will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2220532

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.