Method of fabricating integrated circuits incorporating steps to

Details Method of fabricating integrated circuits incorporating steps to Method of fabricating integrated circuits incorporating steps to

1984-11-05

1986-03-18

Roy, Upendra

Metal working

Method of mechanical manufacture

Assembling or joining

29575, 29576B, 29576T, 148 15, 148187, 2504923, H01L 21265, B01J 1700

Patent

active

045759227

ABSTRACT:
A method of fabricating integrated circuits on a semiconductor substrate includes the steps of directing electromagnetic radiation onto the semiconductor substrate at a small angular offset from the substrate's Bragg angle; measuring the intensity of the radiation that is reflected from the semiconductor substrate at the offset; and continuing with the fabrication of circuits on the substrate only if the measured intensity is substantially larger than the intensity which would reflect at the same angular offset from a defect-free crystal of the substrate material.

REFERENCES:
patent: 3984680 (1976-10-01), Smith
patent: 4021675 (1977-05-01), Shifrin
patent: 4033787 (1977-07-01), Marshall
patent: 4110625 (1978-08-01), Cairns et al.
patent: 4332833 (1982-06-01), Aspnes et al.
patent: 4392893 (1983-07-01), Du et al.
Huff et al. Jour. Electrochem. Soc. 130, Jul. 1983, 1551.

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