Method of fabricating instrument panel

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

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Details

264 465, 264261, 264263, 2643289, 29450, 296 70, B32B 520, B32B 3106, B62D 2514

Patent

active

059762896

ABSTRACT:
A method of fabricating an instrument panel includes providing a skin which forms a surface of the instrument panel and has side face portions extending rearwardly from a front face portion and providing a panel core having a recess for defining a molding space between the panel core and the skin. The front face portion and the side face portions define a bend angle. The recess of the panel core has peripheral walls for engaging the side face portions and the peripheral walls and a surface of the recess define a regular angle which is less than the bend angle. The bend angle, for instance, is larger than the regular angle by 2.degree. to 8.degree., and preferably by 3.degree. to 5.degree.. The panel core is placed in a first die and the skin is place in a second die such that the side face portions are deflected to fit into the recess of the panel core during mold closing. The dies are closed and a foaming material is injected between the panel core and the skin to integrate the panel core and the skin. The side face portions resiliently engage the peripheral walls to prevent leakage of the foaming material. In an embodiment of the method, a skin holding member is movably provided in the second die for holding the side face portions in position during mold closing. The skin holding member is withdrawn to permit engagement of the side face portions with the peripheral walls after mold closing.

REFERENCES:
patent: 3798869 (1974-03-01), Nipp
patent: 3868802 (1975-03-01), Schubach
patent: 4386982 (1983-06-01), Weinhaus
patent: 5500169 (1996-03-01), Kondo et al.
patent: 5618477 (1997-04-01), Suzuki
patent: 5736082 (1998-04-01), Funato et al.

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