Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2006-03-21
2006-03-21
Hassanzadeh, Parviz (Department: 1763)
Etching a substrate: processes
Forming or treating thermal ink jet article
Reexamination Certificate
active
07014785
ABSTRACT:
A method of fabricating an inkjet nozzle on a wafer substrate is provided. The nozzle comprises a nozzle chamber, an actuator and control circuitry for controlling the actuator. The method comprises the steps of: (a) providing a wafer substrate having control circuitry formed thereon; (b) depositing first sacrificial material on the wafer; (c) forming the actuator on the first sacrificial layer such that the actuator electrically connects with the control circuitry; (d) depositing second sacrificial material over the actuator; (e) defining openings in the second sacrificial material, the openings defining the positions of chamber sidewalls; (f) depositing roof material over the second sacrificial material and into the openings; (g) defining an aperture in the roof material; and (h) removing the first and second sacrificial materials.
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Culbert Roberts
Hassanzadeh Parviz
Silverbrook Research Pty Ltd
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