Method of fabricating image sensor dies for use in assembling ar

Fishing – trapping – and vermin destroying

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437946, 437947, 437974, 437981, 437249, 148DIG28, 156644, 156645, 156647, 156653, H01L 21306

Patent

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048142964

ABSTRACT:
A process for forming individual dies having faces that allow the dies to be assembled against other like dies to form one and/or two dimensional scanning arrays wherein the active side of a wafer is etched to form small V-shaped grooves defining the die faces, relatively wide grooves are cut in the inactive side of the wafer opposite each V-shaped groove, and the wafer cut by sawing along the V-shaped grooves, the saw being located so that the side of the saw blade facing the die is aligned with the bottom of the V-shaped groove so that there is retained intact one side of the V-shaped groove to intercept and prevent cracks and chipping caused by sawing from damaging the die active surface and any circuits thereon.

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