Method of fabricating heat dissipating apparatus

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S613000, C029S890030, C029S890032, C165S080400, C165S104260, C165S104330, C165S185000

Reexamination Certificate

active

07730605

ABSTRACT:
The present invention relates to a method for fabricating a heat dissipating apparatus. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.

REFERENCES:
patent: 4046190 (1977-09-01), Marcus et al.
patent: 4478277 (1984-10-01), Friedman et al.
patent: 4602679 (1986-07-01), Edelstein et al.
patent: 5099311 (1992-03-01), Bonde et al.
patent: 5242644 (1993-09-01), Thompson et al.
patent: 5275237 (1994-01-01), Rolfson et al.
patent: 5386143 (1995-01-01), Fitch
patent: 5394936 (1995-03-01), Budelman
patent: 5465782 (1995-11-01), Sun et al.
patent: 5769154 (1998-06-01), Adkins et al.
patent: 6039114 (2000-03-01), Becker et al.
patent: 6082443 (2000-07-01), Yamamoto et al.
patent: 6101715 (2000-08-01), Fuesser et al.
patent: 6167948 (2001-01-01), Thomas
patent: 6257320 (2001-07-01), Wargo
patent: 6337794 (2002-01-01), Agonafer et al.
patent: 6415860 (2002-07-01), Kelly et al.
patent: 6437981 (2002-08-01), Newton et al.
patent: 6477045 (2002-11-01), Wang et al.
patent: 6629559 (2003-10-01), Sachs et al.
patent: 6725909 (2004-04-01), Luo et al.
patent: 6811744 (2004-11-01), Keicher et al.
patent: 6935412 (2005-08-01), Mueller et al.
patent: 6997244 (2006-02-01), Hul-Chun et al.
patent: 2002/0022261 (2002-02-01), Anderson et al.
patent: 2002/0056542 (2002-05-01), Yamamoto et al.
patent: 2003/0085024 (2003-05-01), Santiago et al.
patent: 2003/0213580 (2003-11-01), Philpott et al.
patent: 2005/0178317 (2005-08-01), Quake et al.
patent: 501722 (2002-09-01), None
patent: 528151 (2003-04-01), None

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