METHOD OF FABRICATING GROUP-III NITRIDE SEMICONDUCTOR...

Single-crystal – oriented-crystal – and epitaxy growth processes; – Forming from vapor or gaseous state – With decomposition of a precursor

Reexamination Certificate

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Reexamination Certificate

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06852161

ABSTRACT:
A method of fabricating a film of group-III nitride semiconductor crystal includes a step of using metal material to deposit particles of a group III metal on a substrate surface in an atmosphere containing no nitrogen source, a step of nitriding the particles in an atmosphere containing a nitrogen source and no metal material, and a step of growing group-III nitride semiconductor crystal on the substrate surface on which the particles have been deposited.

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S. Haffouz et al.,The effect of the SiN treatment of a nitridated sapphire surface on the growth mode of GaN in low-pressure metalorganic vapor phase epitaxy,Applied Physics letters, vol. 73, No. 9, pp. 1278-10280 (Aug. 1998).
Takahiro Ito et al.,Effect of AlN buffer layer deposition conditions on the properties of GaN layer, Journal of Crystal Growth, 205 (1999) 20-24.
Korean Office Action for Korean Patent Application No. 10-2002-7004863 dated Jun. 29, 2004.

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