Method of fabricating flip chip ball grid array package

Details Method of fabricating flip chip ball grid array package Method of fabricating flip chip ball grid array package

2006-05-09

2006-05-09

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S108000

Reexamination Certificate

active

07041531

ABSTRACT:
A method of fabricating a flip chip ball grid array (FC-BGA) package is provided. First, a substrate including a first surface and a second surface is provided, wherein the first surface includes a plurality of cavities. Then, a plurality of flip chips is adhered in the cavities of the substrate. Thereafter, an underfill filling step is performed to fill an underfill between the substrate the flip chips. Then, a ball placement step is performed to attach a plurality of solder balls to a second surface of the substrate. Thereafter, the substrate is divided to separate a portion of the substrate adhering to the flip chips from a sidewall of the cavities.

REFERENCES:
patent: 6031284 (2000-02-01), Song
patent: 6548330 (2003-04-01), Murayama et al.
patent: 6570469 (2003-05-01), Yamada et al.
patent: 6686223 (2004-02-01), Uchida
patent: 6696764 (2004-02-01), Honda

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