Method of fabricating flexible circuits for integrated...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

Other Related Categories

C029S846000, C029S825000, C029S830000, C174S264000, C174S254000, C174S250000, C174S255000, C174S262000

Type

Reexamination Certificate

Status

active

Patent number

06915566

Description

ABSTRACT:
A method for the fabrication of a double-sided electrical interconnection flexible circuit (200) particularly useful as a substrate for an area array integrated circuit package. A copper matrix with studs (203) is pressed through a dielectric film (201) having a copper layer on the opposite surface, thereby forming an intermediate structure for a flex circuit with self-aligned solid copper vias in a one step process. The contacts are reinforced by plating both surfaces with a layer of copper, and conventional processes are used to complete the circuit patterning.

REFERENCES:
patent: 2427144 (1947-09-01), Jensen
patent: 4048438 (1977-09-01), Zimmerman
patent: 4177519 (1979-12-01), Kasubuchi et al.
patent: 4383363 (1983-05-01), Hayakawa et al.
patent: 4949155 (1990-08-01), Tajima et al.
patent: 5243142 (1993-09-01), Ishikawa et al.
patent: 5535101 (1996-07-01), Miles et al.
patent: 5600103 (1997-02-01), Odaira et al.
patent: 5736681 (1998-04-01), Yamamoto et al.
patent: 5737833 (1998-04-01), Motomura et al.
patent: 5758413 (1998-06-01), Chong et al.
patent: 5798563 (1998-08-01), Feilchenfeld et al.
patent: 5870289 (1999-02-01), Tokuda et al.
patent: 5909010 (1999-06-01), Inoue
patent: 5979044 (1999-11-01), Sumi et al.
patent: 6010769 (2000-01-01), Sasaoka et al.
patent: 6052287 (2000-04-01), Palmer et al.
patent: 6075710 (2000-06-01), Lau

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