Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-07-12
2005-07-12
Chang, Richard (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S846000, C029S825000, C029S830000, C174S264000, C174S254000, C174S250000, C174S255000, C174S262000
Reexamination Certificate
active
06915566
ABSTRACT:
A method for the fabrication of a double-sided electrical interconnection flexible circuit (200) particularly useful as a substrate for an area array integrated circuit package. A copper matrix with studs (203) is pressed through a dielectric film (201) having a copper layer on the opposite surface, thereby forming an intermediate structure for a flex circuit with self-aligned solid copper vias in a one step process. The contacts are reinforced by plating both surfaces with a layer of copper, and conventional processes are used to complete the circuit patterning.
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Abbott Donald C.
Cotugno John E.
Fritzsche Robert M.
Sabo Robert A.
Sullivan Christopher M.
Brady W. James
Chang Richard
Swayze, Jr. W. Daniel
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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