Method of fabricating elevated temperature application parts wit

Details Method of fabricating elevated temperature application parts wit Method of fabricating elevated temperature application parts wit

1997-10-28

1999-11-02

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electroforming or composition therefor

Mold, mask, or masterform

205 67, C25D 110

Patent

active

059763400

ABSTRACT:
A method is disclosed for fabricating a low cost, elevated-temperature resistant part with a serrated surface and elevated-temperature structural properties similar to (within fifty percent (50%)) a superalloy material comprising the steps of: forming a master tool having the desired serrated surface; electro-forming the elevated-temperature resistant part by depositing three alloying elements comprising nickel, cobalt and manganese onto the master tool in the amounts of about 60%-70% nickel, 40%-30% cobalt and 0.05%-0.10% manganese; and separating the elevated-temperature resistant part from master tool.

REFERENCES:
patent: 5183551 (1993-02-01), Werthmann
patent: 5230259 (1993-07-01), Sheldon
patent: 5453173 (1995-09-01), Oyama
W.H. Prine "Electrofoming Difficult Shapes", Product Engineering, vol. 19, No. 12, pp. 86-89, Dec. 1948.
H.D. Rice A New Look at Electroformed Parts, Material & Methods, Reinhold Publishing Corp., Sep. 1955.
W.H. Safranek "Don't Overlook Electroforming", Product Engineering, pp. 609-613, Jun. 1961.
Marv Rubenstein "Some Tips on Electroforming" Metal Finishing, pp. 52-56, Feb. 1965.

Affiliated with

Also associated with

Rating

Method of fabricating elevated temperature application parts wit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating elevated temperature application parts wit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating elevated temperature application parts wit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2130120