Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1997-08-22
2000-07-11
Luebke, Renee
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 77, H01R 100
Patent
active
060863846
ABSTRACT:
A method of fabricating an improved electronic device, along with the product of that method is disclosed. A flat flexible substrate is provided with a generally round hole of a given diameter and with a conductive film on the substrate in an area at least about the hole. A generally round terminal pin is provided with a given diameter greater than that of the hole. The difference between the diameter of the pin and the diameter of the hole is on the order of 5% to 50% of the diameter of the hole. A non-conductive adhesive is applied to a portion of the pin or the substrate surrounding the hole. The pin is inserted into the hole in the substrate such that the non-conductive adhesive is scraped longitudinally from or along the pin to an area about the hole and the pin, leaving the pin in contact with the conductive film. An improved interface is established between the pin and the conductive film of the substrate.
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Fuerst Robert M.
Hester Todd A.
Krehbiel Fred Love
Caldwell Stacey E.
Luebke Renee
Molex Incorporated
Patel T. C.
LandOfFree
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