Method of fabricating electronic component using resist...

Etching a substrate: processes – Forming or treating article containing magnetically...

Reexamination Certificate

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Reexamination Certificate

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10652053

ABSTRACT:
A method for milling a structure. A single- or multi-layer resist having no undercut is added to a surface of a structure to be milled, the surface to be milled defining a plane. A milling process, such as ion milling, is performed. The milling process includes milling the structure at high incidence and milling the structure at razing incidence. The milling process can be performed only once, or repeated multiple times. High incidence can be defined as about 65 to about 90 degrees from the plane of the surface being milled. Razing incidence can be defined as about 0 to about 30 degrees from the plane of the surface being milled.

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patent: 6329211 (2001-12-01), Terunuma et al.
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patent: 6723252 (2004-04-01), Hsiao et al.
patent: 2002/0011460 (2002-01-01), Seigler et al.
patent: 2001028364 (2001-01-01), None
Office Action from U.S. Appl. No. 11/200,757 mailed Jun. 4, 2007.

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