Metal fusion bonding – With means to juxtapose and bond plural workpieces – Plural discrete workpieces
Patent
1995-12-22
1998-10-06
Heinrich, Samuel M.
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Plural discrete workpieces
228 8, 228 42, H05K 334
Patent
active
058164731
ABSTRACT:
An apparatus comprises a sputter cleaning device, an alignment device operable in atmospheric condition and a heating and soldering device in the form of a belt furnace operable in non-oxidizing or reducing environment. Instead of the sputter cleaning device, a mechanical polishing or cutting device can be used to clean a surface of solder or a member to be bonded or a solder ball plated with gold may be used. An alignment between two members to be bonded is provided by an alignment mark means which comprises a protrusion on a surface of one member and a complimentary recess formed at a center portion of a protrusion means formed on a corresponding surface of the other member.
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Harada Masahide
Hayashida Tetsuya
Nishikawa Toru
Satoh Ryohei
Shirai Mitugu
Heinrich Samuel M.
Hitachi , Ltd.
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