Method of fabricating electronic circuit device and apparatus fo

Details Method of fabricating electronic circuit device and apparatus fo Method of fabricating electronic circuit device and apparatus fo

1992-05-29

1994-08-30

Bradley, P. Austin

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

22818021, 228219, B23K 3102

Patent

active

053419804

ABSTRACT:
In a method of soldering for use in fabricating electronic circuit device, after an oxide layer and/or contaminated layer on a surface of a soldering material and members to be soldered thereby is removed by sputter-cleaning with atom or ion, the members are aligned in an oxidizing atmosphere within a predetermined time period and, then, the soldering material is heated in non-oxidizing atmosphere to performe soldering. An apparatus for performing the above method comprises a sputter cleaning device, an alignment device operable in atmospheric condition and a heating and soldering device in the form of a belt furnace operable in non-oxidizing or reducing environment. Instead of the sputter cleaning device, a mechanical polishing or cutting device can be used to cleaning a surface of solder or a member to be bonded or a solder ball plated with gold may be used. An alignment between two members to be bonded is provided by an alignment mark means which comprises a protrusion on a surface of one member and a complimental recess formed at a center portion of a protrusion means formed on a corresponding surface of the other member.

REFERENCES:
patent: 4379218 (1983-04-01), Grebe
patent: 4865245 (1989-09-01), Schulte
patent: 4921157 (1990-05-01), Dishon
patent: 4979664 (1990-12-01), Lyons
patent: 5115964 (1992-05-01), Ameen et al.
Improvement in Solderability By Laser Irradiation, International Tech. Discl. vol. 10 No. 8, Aug. 1992.

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