Method of fabricating electrode plate for supporting semiconduct

Details Method of fabricating electrode plate for supporting semiconduct Method of fabricating electrode plate for supporting semiconduct

1979-05-08

1981-03-10

Husar, Francis S.

Metal working

Method of mechanical manufacture

Electrical device making

29589, 29591, H01R 4302

Patent

active

042545480

ABSTRACT:
A bundle of carbon fibers each coated with copper or copper alloy is uniformly wound around a core rod under tension, and subjected to a hot press treatment in a non-oxidizing atmosphere. The core rod is then cut off along the surface of a plate formed by the hot-press to form a supporting electrode plate for a semiconductor device. The electrode plate thus fabricated incorporates therein carbon fibers in a spiral and concentric circular array around the core rod.

REFERENCES:
patent: 3550247 (1970-12-01), Evans et al.
patent: 3759353 (1973-09-01), Marin
patent: 3918141 (1975-11-01), Pepper et al.
patent: 4072817 (1978-02-01), Waite
patent: 4083719 (1978-04-01), Arakawa et al.

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