Method of fabricating electrical contacts in a printed circuit b

Details Method of fabricating electrical contacts in a printed circuit b Method of fabricating electrical contacts in a printed circuit b

1979-10-25

1982-02-23

Husar, Francis S.

Metal working

Method of mechanical manufacture

Electrical device making

134 38, 252153, H05K 322

Patent

active

043163220

ABSTRACT:
Disclosed is a method of fabricating electrical contacts between the conductive layers of a printed circuit board which are spaced apart from each other by respective epoxy layers. The method includes the steps of drilling holes through all of the layers at predetermined points where the electrical contacts are to be made; subsequently washing the board in an acid to remove an epoxy smear that is formed on the walls of the holes by the drilling step; and thereafter rinsing the board in a mixture of 2-butoxyethanol and monoethanolamine to remove chemical byproducts of the epoxy smear and the acid.

REFERENCES:
patent: 3276106 (1966-10-01), Bester et al.
patent: 3551204 (1970-12-01), Bolger et al.
patent: 3649475 (1972-03-01), Degnan et al.
patent: 3839234 (1974-10-01), Roscoe
patent: 3886099 (1975-05-01), Hall
IBM Tech. Discl. Bull., vol. 6, No. 8, Jan. 8, 1964, by Reed (p. 82).
IBM Tech. Discl. Bull., vol. 10, No. 7, Dec. 7, 1967, by Krawczyk (p. 868).

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