Semiconductor device manufacturing: process – Manufacture of electrical device controlled printhead
Reexamination Certificate
2006-06-20
2006-06-20
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Manufacture of electrical device controlled printhead
C438S051000, C438S113000, C438S118000, C438S458000, C438S464000
Reexamination Certificate
active
07063993
ABSTRACT:
A method of fabricating devices incorporating microelectromechanical systems (MEMS) using a UV curable tape includes providing a substrate (14) with a MEMS layer (18) arranged on one side (12) of the substrate (14). A further layer (10) is applied to the side (12) of the substrate (14). At least one operation is performed on the substrate (14) from a side (22) of the substrate (14) opposed to the side (12) having the MEMS layer (18). A holding tape (38) is applied to the side (22) of the substrate. At least one operation is then performed on the further layer (10) to define individual chips (20). Each chip (20) is composed of a part of the substrate (24), at least one part of the MEMS layer (18) and a part of the further layer (10). Individual chips (20) are then able to be released from the tape (38) by exposing the tape (38) to UV light.
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Goodwin David
Nelms David
Silverbrook Research Pty Ltd
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