Plastic and nonmetallic article shaping or treating: processes – Vacuum treatment of work – To degas or prevent gas entrapment
Patent
1985-08-30
1987-07-21
Anderson, Philip
Plastic and nonmetallic article shaping or treating: processes
Vacuum treatment of work
To degas or prevent gas entrapment
264500, 264548, 26427211, 26427213, 26433112, 26433116, B29C 3910, B29C 3924, B29C 3942
Patent
active
046817182
ABSTRACT:
A method for encapsulating an electrical component or forming a resin based filler reinforced composite article which comprises providing a rigid mold having a cavity and an opening in one surface of the mold connected to the cavity, and a chamber in which the mold is placed for applying heat and varying pressure to the mold contents. The chamber is preheated to the curing temperature of the resin and is maintained at this temperature. The component or filler is loaded into the mold cavity and the mold is placed in the preheated chamber. Then the mold cavity is filled with a low viscosity heat curable, thermosetting resin such as an epoxy resin. Next, the mold cavity is evacuated to a subatmospheric pressure to impose a vacuum on the mold to impregnate the component or filler with the resin, degas the mold cavity contents, and expand any voids in the resin. The vacuum is released to atmospheric pressure to collapse any gas bubbles remaining in the mold contents. Then, a superatmospheric pressure is applied to the mold to burst any gas bubbles and cause the resin to compact and encapsulate the component or filler. The temperature and the superatmospheric pressure are maintained for a time sufficient to partially cure the resin and form a unitary structure which can be ejected from the mold. The ejected structure is then subjected to further heating to completely cure the resin. The method may be performed in cyclic fashion to form continuously in sequence a plurality of encapsulated components or composite articles.
Composite articles so formed are useful as structures, such as antenna waveguides, for space applications. Electrical components encapsulated by the process of the present invention have high voltage resistance.
REFERENCES:
patent: 3028284 (1962-04-01), Reeves
patent: 3541194 (1970-11-01), Resnick
patent: 4289722 (1981-09-01), Tranbarger
patent: 4321418 (1982-03-01), Dran et al.
patent: 4333900 (1982-06-01), Carey
patent: 4374080 (1983-02-01), Schroeder
Katz, H. S. and J. V. Milewski, Handbook of Fillers and Reinforcements for Plastics, New York, Van Nostrand Reinhold, .RTM.1978, pp. 66-78; 326-330.
Anderson Philip
Hughes Aircraft Company
Karamebelas A. W.
Lachman M. E.
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