Plastic and nonmetallic article shaping or treating: processes – Carbonizing to form article – Agglomeration or accretion
Patent
1988-07-05
1991-02-19
Derrington, James
Plastic and nonmetallic article shaping or treating: processes
Carbonizing to form article
Agglomeration or accretion
264 59, 264 61, 264 63, C04B 3806
Patent
active
049942158
ABSTRACT:
A substrate and method of manufacture wherein a substrate is molded from particulate material wherein grooves on and through the body are formed during substrate molding and prior to sintering. The substrate includes all buss structure molded therein. Cooling of chips is provided by providing a heat sink in grooves formed within a substrate and beneath the chips. Microcircuits are formed by disposing on the substrate and interconnecting via buss structures on the substrate various semiconductor dies with encapsulation of some or all of the substrates and components thereon, if desired. In addition, connection from the board to external circuits is available by means of an edge connector.
REFERENCES:
patent: 3539667 (1970-11-01), Nameishi
patent: 4374457 (1983-02-01), Wiech
Cantor Jay M.
Derrington James
Fine Particle Technology Corp.
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