Method of fabricating complex microcircuit boards, substrates an

Details Method of fabricating complex microcircuit boards, substrates an Method of fabricating complex microcircuit boards, substrates an

1984-10-30

1985-12-31

Smith, John D.

Coating processes

Electrical product produced

264 61, 427 86, 427 96, 427101, 427287, 4273744, H05K 312, B05D 512, B05D 128

Patent

active

045620920

ABSTRACT:
A substrate and method of manufacture wherein a substrate is molded from particulate material wherein grooves on and through the body are formed during substrate molding and prior to sintering. The substrate includes all buss structure molded therein. Cooling of chips is provided by providing a heat sink in grooves formed within a substrate and beneath the chips. Microcircuits are formed by disposing on the substrate and interconnecting via buss structures on the substrate various semiconductor dies with encapsulation of some or all of the substrates and components thereon, if desired. In addition, connection from the board to external circuits is available by means of an edge connector.

REFERENCES:
patent: 3872044 (1975-03-01), Hervey
patent: 4374457 (1983-02-01), Wiech
Brunetti et al., "Printed Circuit Techniques", National Bureau of Standards Circular 468, Nov. 1947.

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