Method of fabricating complex micro-circuit boards and substrate

Details Method of fabricating complex micro-circuit boards and substrate Method of fabricating complex micro-circuit boards and substrate

1980-08-04

1983-02-22

Rutledge, L. Dewayne

Metal working

Method of mechanical manufacture

Electrical device making

29589, 29840, 29848, 264 61, 264 63, 264154, 357 68, 357 82, 361382, 361401, H01L 2336, H01L 2352, C04B 3332, C04B 4114

Patent

active

043744575

ABSTRACT:
A substrate and method of manufacture wherein a substrate is molded from particulate material wherein grooves on and through the body are formed during substrate molding and prior to sintering. The substrate includes all buss structure molded therein. Cooling of chips is provided by providing a heat sink in an aperture formed within a substrate and beneath the chips.

REFERENCES:
patent: 3438127 (1969-04-01), Lehtonen
patent: 4289719 (1981-09-01), McIntosh et al.

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